基于Cu、Sn预成型焊片的高温SiC芯片焊接材料研究
徐红艳, 周润晖, 宁圃奇, 徐菊
Studies on high temperature SiC chip dieattached material based on Cu、Sn preformed solder sheet
XU Hong-yan, ZHOU Run-hui, NING Pu-qi, XU Ju
电工电能新技术 . 2018, (10): 39 -43 .  DOI: 10.12067/ATEEE1808039