Review of IGBT power module packaging failure mechanism and monitoring methods

YIN Zhi-hao, YU Dian-ru, ZHU Jia-feng, SHEN Yao-chun, XU Ju,

Advanced Technology of Electrical Engineering and Energy ›› 2022, Vol. 41 ›› Issue (8) : 51-70.

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Advanced Technology of Electrical Engineering and Energy ›› 2022, Vol. 41 ›› Issue (8) : 51-70. DOI: 10.12067/ATEEE2108044
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Review of IGBT power module packaging failure mechanism and monitoring methods

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 41(8): 51-70 https://doi.org/10.12067/ATEEE2108044

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