Thermal impedance model for IGBT modules considering heat spreading and thermal coupling

HE Yi-gang, ZHANG Zhong-tao, LIU Jia-cheng, ZHAO Ming, LI Chen-chen

Advanced Technology of Electrical Engineering and Energy ›› 2020, Vol. 39 ›› Issue (5) : 17-24.

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Advanced Technology of Electrical Engineering and Energy ›› 2020, Vol. 39 ›› Issue (5) : 17-24. DOI: 10.12067/ATEEE1904033
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Thermal impedance model for IGBT modules considering heat spreading and thermal coupling

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 39(5): 17-24 https://doi.org/10.12067/ATEEE1904033

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