Studies on high temperature SiC chip dieattached material based on Cu、Sn preformed solder sheet

XU Hong-yan, ZHOU Run-hui, NING Pu-qi, XU Ju

Advanced Technology of Electrical Engineering and Energy ›› 2018, Vol. 37 ›› Issue (10) : 39-43.

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Advanced Technology of Electrical Engineering and Energy ›› 2018, Vol. 37 ›› Issue (10) : 39-43. DOI: 10.12067/ATEEE1808039
Special Issues for High Power Density SiC Converter Technic

Studies on high temperature SiC chip dieattached material based on Cu、Sn preformed solder sheet

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 37(10): 39-43 https://doi.org/10.12067/ATEEE1808039

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