Analysis of fault characteristics of IGBT bonding wire lift off

KONG Mei-juan, LI Zhi-gang, ZHAO Wang-wang

Advanced Technology of Electrical Engineering and Energy ›› 2018, Vol. 37 ›› Issue (10) : 83-88.

PDF(1846 KB)
PDF(1846 KB)
Advanced Technology of Electrical Engineering and Energy ›› 2018, Vol. 37 ›› Issue (10) : 83-88. DOI: 10.12067/ATEEE1708055
Special Issues for High Power Density SiC Converter Technic

Analysis of fault characteristics of IGBT bonding wire lift off

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 37(10): 83-88 https://doi.org/10.12067/ATEEE1708055

References

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(1846 KB)

Accesses

Citation

Detail

Sections
Recommended

/